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| Quality Policy |
- Quality Control
Incoming QC (laminate, Cu foil, drilling)
In-Process QC (Process and product audit, FA approval)
Final QC
Output QC : AQL sampling
- Respond Time
1-day acknowledgment
2-day containment
5-day corrective and preventive action
- Quality Program
Continuous Improvement Program through Task Force, SPC.
Quality Council oversees quality programs adopting TQM criteria
- Capability
Class |
ITEMS |
Current Status |
Technology Readiness |
E/2003 |
E/2004 |
E/2005 |
A. |
Material |
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1. Material |
FR4,FR5,BT,Polyimide,Teflon |
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2.Copper Foils |
0.25oz.(9um) / 0.33oz.(12um) / 0.5oz.(18um) / 1oz.(35um) / 2oz.(70um) |
B. |
Lamination |
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1.Max. Numbers of layers |
20 |
28 |
NA |
NA |
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2.Max. Board thickness |
5.5 |
6 |
NA |
NA |
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3.Min. panel thickness tolerance |
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Panel thickness 0.38-0.77 |
+/- 0.075 |
+/- 0.075 |
NA |
NA |
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Panel thickness 0.78-2.0 |
+/- 0.125 |
+/- 0.125 |
NA |
NA |
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Panel thickness 2.01-3.15 |
+/- 0.200 |
+/- 0.200 |
NA |
NA |
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Panel thickness >3.16 |
+/- 10% |
+/- 10% |
NA |
NA |
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4.Layer to layer registration |
+/- 0.125 |
+/- 0.125 |
NA |
NA |
C. |
Artwork Capabilities |
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1. Min. Trace and Space (0.25oz.) |
0.076 / 0.076 |
0.076 / 0.076 |
0.063 / 0.063 |
0.05 / 0.05 |
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2. Min. Trace and Space (0.33oz.) |
0.1 / 0.1 |
0.1 / 0.1 |
0.076 / 0.076 |
0.063 / 0.063 |
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3. Min. Trace and Space (0.5oz.) |
0.127 / 0.127 |
0.127 / 0.127 |
0.1 / 0.1 |
0.076 / 0.076 |
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4. Min. Trace and Space (1.0oz.) |
0.15 / 0.15 |
0.15 / 0.15 |
0.127 / 0.127 |
0.1 / 0.1 |
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5. Min. Space Outerlayer Trace to NPH |
0.25 |
0.25 |
0.2 |
0.2 |
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6. Min. Space Innerlayer Trace to NPH |
0.3 |
0.3 |
0.25 |
0.25 |
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7. Min. Space Outerlayer Trace to Board Edge |
0.25 |
0.25 |
0.2 |
0.2 |
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8. Min. Space Innerlayer Trace to
Board Edge |
0.4 |
0.4 |
0.35 |
0.35 |
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9. Min. Outerlayer Pad Diameter =
FHS plus |
dr+0.35 |
dr+0.35 |
dr+0.30 |
dr+0.25 |
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10. Min. Innerlayer Pad Diameter =
FHS plus |
dr+0.4 |
dr+0.4 |
dr+0.35 |
dr+0.3 |
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11. Min. Innerlayer Plane Clearance = FHS plus |
dr+0.6 |
dr+0.6 |
dr+0.5 |
dr+0.4 |
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12. Min. Space Between Coverlay Openings |
0.25 |
0.25 |
0.25 |
0.25 |
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13. Edge of Coverlay Opening to Trace |
.018 (preferred) |
.018 (preferred) |
NA |
NA |
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14. Min. Legend Line Width |
0.15 |
0.15 |
0.12 |
0.08 |
D. |
Drill Capabilities |
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1. Finish Hole Diameter Tolerance |
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. Plated |
+/- 0.075 |
+/- 0.075 |
+/- 0.065 |
+/- 0.050 |
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. Non-plated |
+/- 0.025 |
+/- 0.025 |
+/- 0.025 |
+/- 0.025 |
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2. Cu Thickness in Through Hole |
> 0.025 |
> 0.025 |
> 0.025 |
> 0.025 |
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3. Via Formation |
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Mechanical drilling |
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a. Aspect Ratio |
7 |
7 |
8 |
10 |
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b. Min. Drilled Microvia Diameter |
0.25 |
0.25 |
0.2 |
0.15 |
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c. Min. Finished Microvia Diameter |
0.2 |
0.2 |
0.15 |
0.1 |
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d. Min. Hole-edge-to-Hole edge(dependent on material and drill bit) |
0.35 |
0.35 |
0.3 |
0.25 |
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Laser drilling of microvias |
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a. Aspect Ratio |
0.7 |
0.7 |
NA |
NA |
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b. Min. Drilled Micro Via Diameter |
0.075 |
0.075 |
NA |
NA |
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c. Min. Finished Micro Via Diameter |
0.025 |
0.025 |
NA |
NA |
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Plasma etching |
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a. Aspect Ratio |
NA |
NA |
NA |
NA |
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b. Min. Etched Micro Via Diameter |
NA |
NA |
NA |
NA |
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c. Min. Finished Micro Via Diameter |
NA |
NA |
NA |
NA |
E. |
Fabrication Tolerances |
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1. Min. Trace to Route Edge Dimension |
+/- 0.38 |
+/- 0.38 |
+/- 0.25 |
+/- 0.2 |
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2. Min. Route Dimensional Tolerance |
+/- 0.13 |
+/- 0.13 |
+/- 0.1 |
+/- 0.1 |
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3. Min. Feature to Feature Dimensional Tolerance |
+/- 0.13 |
+/- 0.13 |
+/- 0.1 |
+/- 0.1 |
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4. Impedance Tolerance
(Design dependent) (50Ohm+) |
+/- 10% |
+/- 10% |
+/- 8% |
+/- 6% |
F. |
Solder Mask |
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1. Min. Solder mask clearance |
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. Plated (Pad plus) |
0.2 |
0.2 |
0.15 |
0.1 |
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. Non-plated (FSH plus) |
0.2 |
0.2 |
0.15 |
0.1 |
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2. Min. Solder mask Width- on FR4 |
0.1 |
0.1 |
0.076 |
0.076 |
G. |
Surface Finish |
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1. Gold/Nickel(Electrolytic Pure Gold) |
Yes |
Yes |
Yes |
Yes |
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2. Gold/Nickel(Electrolytic Hard Gold) |
Yes |
Yes |
Yes |
Yes |
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3. Gold/Nickel (immersion/electroless) |
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a. Nickel thickness |
> 3.8um |
> 3.8um |
> 3.8um |
> 3.8um |
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b. Immersion Gold thickness |
0.05~0.1um |
0.05~0.1um |
0.05~0.1um |
0.05~0.1um |
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c. Electroless Gold thickness |
0.3~0.5um |
0.3~0.5um |
0.3~0.5um |
0.3~0.5um |
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4. Selective EN/IMG + OSP |
Yes |
Yes |
Yes |
Yes |
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5. HASL, solder thickness |
1.27~25.4um |
1.27~25.4um |
1.27~25.4um |
1.27~25.4um |
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6. OSP Thickness |
0.2~0.5um |
0.2~0.5um |
0.2~0.5um |
0.2~0.5um |
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7. Immersion Silver |
No |
No |
Yes |
Yes |
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8. Immersion Tin |
No |
No |
Yes |
Yes |
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9. No-Lead Compatible |
No |
No |
Yes |
Yes |
H. |
Electrical Test Capabilities |
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1. Smallest SMD Pitch |
0.25 |
0.25 |
0.25 |
0.25 |
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2. Smallest BGA Pitch |
1 |
1 |
0.8 |
0.8 |
I. |
Controlled Impedance |
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1. Impedance Control Tolerance |
+/- 10% |
+/- 10% |
+/- 8% |
+/- 6% |
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2. Differential Impedance Control Tolerance |
+/- 10% |
+/- 10% |
+/- 8% |
+/- 6% |
- Quality assurance control flow chart
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